With the continuous development of SMT electronic components towards miniaturization, chip integration is becoming higher and higher. Whether it is laptops, smartphones, medical devices, automotive electronics, military and aerospace products, the application of array packaged BGA, CSP and other devices in products is increasing, and the quality requirements for products are also increasing.
With the continuous development of SMT electronic components towards miniaturization, chip integration is becoming higher and higher. Whether it is laptops, smartphones, medical devices, automotive electronics, military and aerospace products, the application of array packaged BGA, CSP and other devices in products is increasing, and the quality requirements for products are also increasing. 5G was a hot topic in 2019, and now the era of 5G has begun. From the perspective of the interior of mobile phone PCBA circuit boards, compared to 4G phones, the design difficulties of 5G phones mainly focus on RF, antennas, etc., in addition to the baseband chip. Due to the fact that 5G has at least 1 times higher frequency, 5 times wider bandwidth, up to 29 frequency bands, 5 times higher power, 10 times higher speed, and dozens of times more antennas than 4G.
All of this requires us to continuously improve our process capabilities, increase * * equipment, and ensure high reliability products through high-quality welding. There are many SMT production equipment in high-precision electronic manufacturing processes, including SMT automatic X-RAY marking machine, SMT first piece inspection instrument, fully automatic solder paste printing machine, online 3D-SPI solder paste printing inspection instrument, surface mounting machine, reflow soldering, online AOI optical inspection instrument, online PCBA fully automatic milling cutter plate machine, etc. Each device has a specific function and purpose, and the reflow soldering oven is the post-processing step of the SMT production line, responsible for melting the solder of the already mounted PCB circuit board and components and bonding them to the motherboard.
Reflow soldering has become the mainstream process of SMT. Most of the components on our commonly used smartphone boards are soldered to the circuit board through this process, relying on the effect of hot air flow on the solder joints. The adhesive solder undergoes physical reactions under a certain high-temperature air flow to achieve SMD soldering; The reason why it is called "reflow soldering" is because the gas circulates in the welding machine to generate high temperature to achieve the welding purpose; There are also many types of reflow soldering furnaces, such as hot air reflow soldering, nitrogen reflow soldering, gas phase reflow soldering, vacuum reflow soldering, etc.
